Hello everyone 
I hope everybody is doing well. I would like to look for guidance from experts on improving the printed circuit board structure for powerful software. I have been focusing on a project using radio frequency and microwave technology; and I hope to improve the structure of it for more powerful durability and efficient operation.
The project includes creating a pcb for a device for wireless communication that runs at the ghz frequency. It is high frequency components found in a system include boosters; blenders; filters; and transmitters. I have finished the first structure and development phase.
- While the working version is operational;, I am experiencing problems with signal integrity; electromagnetic interference; and control of heat.
- Which are the best ways to build tracks for high frequency signals? Are there any guidelines for wire length; spacing; and routing that can help minimise resistance difficulties and transmission loss?
- What can I plan ground planes to deal with emi? Are there any productive protecting methods anyone suggests for high frequency pcb?
- Which methods should I apply when connecting high frequency parts to minimise disturbance and interaction? Are there any factors for maintaining small parts separate from noise devices?
- Which are the best temperature control methods for high-frequency pcb? Are there materials; cooling systems; and structural factors that can improve heat dissolution?
- Can anyone suggest any generative tools which are beneficial for studying and improving high frequency pcb layouts? This is a request for tools to help with the quality of signals research; temperature, and emi detection.
I have gone through some posts related to this, https://forum.diode.io/t/private-cloud-looker-via-web3-visible-on-web2-part-1/15 they have been helpful; but I am looking for more detailed guidance on printed circuit board structure
Thanks in advance for your help. 
I am looking for your suggestions on how to improve my pcb structure.