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Hello everyone :wave:

I hope everybody is doing well. I would like to look for guidance from experts on improving the printed circuit board structure for powerful software. I have been focusing on a project using radio frequency and microwave technology; and I hope to improve the structure of it for more powerful durability and efficient operation.

The project includes creating a pcb for a device for wireless communication that runs at the ghz frequency. It is high frequency components found in a system include boosters; blenders; filters; and transmitters. I have finished the first structure and development phase.

  • While the working version is operational;, I am experiencing problems with signal integrity; electromagnetic interference; and control of heat.
  • Which are the best ways to build tracks for high frequency signals? Are there any guidelines for wire length; spacing; and routing that can help minimise resistance difficulties and transmission loss?
  • What can I plan ground planes to deal with emi? Are there any productive protecting methods anyone suggests for high frequency pcb?
  • Which methods should I apply when connecting high frequency parts to minimise disturbance and interaction? Are there any factors for maintaining small parts separate from noise devices?
  • Which are the best temperature control methods for high-frequency pcb? Are there materials; cooling systems; and structural factors that can improve heat dissolution?
  • Can anyone suggest any generative tools which are beneficial for studying and improving high frequency pcb layouts? This is a request for tools to help with the quality of signals research; temperature, and emi detection.

I have gone through some posts related to this, https://forum.diode.io/t/private-cloud-looker-via-web3-visible-on-web2-part-1/15 they have been helpful; but I am looking for more detailed guidance on printed circuit board structure

Thanks in advance for your help. :heart: I am looking for your suggestions on how to improve my pcb structure.

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Hello there @Aurora :heart:
When you have to design a high-frequency PCB, consider some key aspects that are:

  • You have to use narrow traces and then follow the transmission line theory.
  • Keep in mind that you have to use multilayer PCBs to separate power, ground, and signal planes.
  • Create solid ground planes and partition analog and digital grounds and place critical components close together and avoid long traces to manage heat with copper pours, thermal vias, and appropriate materials

And the main tip I would like to give you is use professional tools like Altium Designer or KiCad to optimize your design and ensure signal integrity.